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The state of analysis techniques, including defect analysis of joints, adhesion, and assembly parts.

Introducing the perspectives from which analysis and analytical techniques should be advanced!

Our company supports customers in solving their challenges and issues not only with electronic components but also with a wide range of products, parts, and materials, including inorganic and organic materials, through failure analysis, defect analysis, structural analysis, and reliability evaluation. This document introduces how to approach analysis and evaluation techniques from various perspectives. We hope it serves as a starting point for problem-solving and provides assistance in unraveling issues for our customers. [Contents] ■ Introduction ■ Image of Joining and Positioning of Our Evaluation and Analysis Techniques ■ Causes of Defects ■ Methods ■ Conclusion *For more details, please refer to the PDF document or feel free to contact us.

  • Other analyses
  • Failure Analysis Equipment

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Equipment Fault Analysis Device "Miharu-kun"

We will assist you with the failure analysis of production equipment.

"Mihauru-kun" is an equipment failure analysis device that enables the analysis of failure causes at a low cost through the file storage function of PLC equipment abnormality information. The saved videos are in a common format, so they can be viewed with applications such as Windows Media Player, and you can also build a monitoring system using your own computer and webcam. [Features] ■ Records failure images triggered by equipment failure signals ■ Monitoring can start without modifying the equipment if triggered by PLC devices ■ Recording reservation function with a preset date and time *For more details, please download the PDF or feel free to contact us.

  • Other analyses
  • Failure Analysis Equipment

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Lock-in thermal analysis method

The lock-in thermal analysis method detects slight temperature increases in the current path.

- The IR-OBIRCH function is also included, allowing for further narrowing down of the fault location after identifying the heat generation area through IR-OBIRCH measurement. - By detecting infrared, it is possible to non-destructively identify fault locations without the need for opening the package through etching or removing electrodes. - By using lock-in signals, it is possible to identify heat generation areas with high S/N, enabling cross-sectional analysis such as Slice & View.

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  • Contract Analysis
  • Contract measurement
  • Contract Inspection
  • Failure Analysis Equipment

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